IIT Jodhpur Research Fellow Job 2021 - Applications Invited

IIT Jodhpur Research Fellow Job 2021 – Applications Invited

IIT Jodhpur Research job. Applications are invited from the citizen of India for filling up the following temporary position in the Sponsored Research Project at this Institute. The position is purely temporary, initially for a period of 09 months, and extendable but co-terminus with the duration of the project, on a contractual basis with consolidated pay. The requisite qualification, experience, and other details are given below:

Project No. S/SERB/DA/20200044

Project Title Controlled Morphologies via Phase-separation in Epoxy Blends for Electronic Sensor & Device Packaging

Project Investigator Dr. Deepak Arora

Duration of Initial Appointment 09 Months

Job Title: Junior Research Fellow

Post 01

Consolidate Pay Rs.31,000/-

Essential Qualification:

B.E./ B.Tech. in a relevant discipline such as Chemical Engineering and NET/ GATE qualified.

Experience:

Courses Done in fundamentals of polymers

Desirable:

B.E./ B.Tech + M.E./ M.Tech. or higher degree in a relevant discipline such as Chemical Engineering, Materials Engineering, Polymer Science & Engineering, Electrical Engineering, Packaging Engineering, etc.

Experience:

•Advanced courses done in polymers, polymer rheology, epoxies, and relevant domains.

• Hands-on laboratory experience in polymer synthesis and formulation.

• Hands-on experience in device/ sensor fabrication.

•Experienced with equipment such as spin coater

, rheometer, DSE, DMA, SEM, AFM optical microscope, FTIR, etc

•Experience with microfabrication.

Job Description

•A Junior research fellow will help in executing the research project and relevant work in the area of cross-linking of epoxy blends.

•Person will be involved in manuscript preparation for submission to journals and conferences.

•Helping in the procurement of equipment and accessories, and the testing and installation.

Brief description of Project

  • Electronic packaging involves packing a semiconductor device, such as chip, memory, photodiodes, LED, etc. with various other components, in an organic, ceramic, or composite environment.
  • Electronic packages find their application in traditional industries including computing, automotive, aerospace, and mobile. The advent of new industries as artificial intelligence, autonomous cars, smart homes, smart cities, and the Internet of Things (IoT) has provided a renewed thrust to electronic packaging. This has pushed the
    requirements for reliability and performance in terms of tighter feature dimensions for dense packages.
  • This imposes additional requirements on the polymer dielectrics that are implemented in the manufacturing of electronic packages. In particular, polymer dielectrics are expected to have better rheological and mechanical properties, higher glass transition
    temperatures, better elongation, and improved adhesion with various interfaces while offering ease of processing and the benefits of low cost.
  • Epoxy resins are some of the crucial polymeric resins for the electronic packaging and semiconductor industry. Understanding the phase- separation for epoxy resins
    is vital in realizing the above-mentioned requirements. Some of the functionalities of epoxies in electronic packaging are,

I) Adhesion layers;

ii) Insulation layers;

iii) Constituent of photosensitive materials;

iv) Stress-relief layers (underfills).

Adhesion between polymers and the inorganic layers is key t the reliability of a device, and typically it is improved by modulating the surface morphology. The objective of this
a research proposal is to understand the fundamentals of phase separation in epoxy blends that will help us enable next-generation requirements including,

i) Finer features;

ii) Thinner dielectric layers;

iii) Thinner conducting layers;

iv) Improved performance via reduced transmission losses and,

v) Reduced metal migration.

A dual-pronged approach, comprising of fundamental material characteristics and thorough
characterization of morphologies will be implemented in this research. We will formulate epoxy blends using polymers with varying chain length and functionality, that will be
analyzed using techniques including Differential Scanning Calorimetry (DSC), Shear rheometry, Dynamic Mechanical Analyzer (DMA), Atomic Force Microscopy (AFM)
and Scanning Electron Microscope (SEM). Under the mission for “Developing Low Cost Highly Reliable and High Performing Polymeric Materials & Technologies for Packaging
of Electronic Devices”, one of our objectives is to design Advanced Epoxy Composites for Future Generations of Device Packaging.

This proposal focuses on understanding the Fundamentals of Phase-separation in Epoxy Blends and its impact on Structure-Property. It will also establish an understanding of composition and corresponding morphology for epoxy blends with a long-term vision to develop epoxy composites and packaging solutions for devices and sensors.

 Maximum age 30 Years

How To Apply:

The candidates possessing the requisite qualification and experience should apply through the ONLINE process up to 30 October 2021. The candidates are advised to send a soft copy of the application with all relevant documents to [email protected] (Please mention the advertisement number in the subject line of the email).No need to send a hard copy.

Last Date To Apply: 30 October 2021

Click Here To Apply Online

View Main Notification

Editors Note: IIT Jodhpur Research Subscribe to Rasayanika for the latest chemistry and Pharma job openings, follow us on Facebook and Telegram and subscribe to our youtube channel for the latest updates on chemistry and Pharma jobs and much more.

LEAVE A REPLY

Please enter your comment!
Please enter your name here